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Wireless Transmitter

Bluetooth Audio SoC

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  • Technical Spec
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General Info

Actions wireless transmission and transceiver series products provide high integration and high performance Bluetooth audio single chip solutions, integrated Bluetooth radio frequency (RF) and baseband, power management unit (PMU), audio codec and MCU. Can be widely used in all kinds of Bluetooth transceiver integrated products, such as gaming earphones and dongle, wireless microphones, conference speakers dongle, communications headset dongle, TV dongle, game-box dongle, intercom adapters, Bluetooth emission slave module, transceiver integrated module, projector/CD/DVD and various devices that require Bluetooth emission (connect Bluetooth headset or Bluetooth speakers) and other low-latency wireless audio transmission and reception products.

 

Actions Bluetooth transmission and transceiver integrated series products support Bluetooth 5.3 dual mode , support LE Audio mode, transmitting power up to 13dBm, receiving sensitivity -96dbm, complete specifications, leading performance. Support multi-device connection, support line-in, USB, SPDIF, I2S, MIC, SD/MMC, SPI, and other audio input source, support all formats of audio decoding, support screen, Bluetooth speakers and Bluetooth headset is compatible with the mainstream market, support AG 16k hd calls, 10 / MAC compatible with Windows 7 / software and other mainstream operating system and the mainstream mobile phone, The latency of HFP calls the end-to-end (dongle to the speaker the whole link) as low as 60 ms, The A2DP supports  the LE Audio mode, which allows end-to-end links  latency to be as low as 20ms or less, making it an industry leader. Support two-way HD voice transmission at the same time.

 

The wireless transmission and transceiver chips are mainly  ATS3031,ATS2831P(L) and ATS2851.

 

Technical Spec PDF Download

BT Version
CPU
DSP
RAM
SPI norflash
Max TX Power (BR)
A2DP
AVRCP
HFP
LE audio
Dual headset connections
ACT-LL(Low latency)
Transmit audio input source
External RF PA
USB
Display
Package
ATS3031 ATS2831P(L) ATS2851 ATS2831
BT Version V5.3 V5.3 V5.3 V5.0
CPU 32bits M4F@96MHz 32bits RISC@264MHz 32bits RISC@234MHz 32bits RISC@240MHz
DSP 32bits DSP@170MHz 32bits DSP@342MHz 32bits DSP@400MHz
RAM Build-in 632KB Build-in 498KB Build-in 203KB Build-in 336KB
SPI norflash Build in 16Mbits Flash Build in 32Mbits Flash Build in 16Mbits Flash Build in 32Mbits Flash
Max TX Power (BR) 13dBm 10dBm 10dBm 6dBm
A2DP V1.3.2 SRC/SNK V1.3.2 SRC/SNK V1.3.2 SRC/SNK V1.3 SRC/SNK
AVRCP V1.6.2 TG/CT V1.6.2 TG/CT V1.6.2 TG/CT V1.6.2 TG/CT
HFP V1.8 AG/HF V1.8 AG/HF V1.8 HF V1.7 AG/HF
LE audio
Dual headset connections
ACT-LL(Low latency) √/24ms(LC3) 23ms(2831P LC3) / 10ms(2831PL LC3+) √/30ms
Transmit audio input source LINEIN/USB/I2S/ MICIN LINEIN/USB/SPDIF/SD/EMMC/I2S/ MICIN LINEIN/USB/SD/EMMC LINEIN/USB/SPDIF/SD/EMMC/I2S/MICIN
External RF PA
USB USB2.0 FS USB2.0 HS USB2.0 FS USB2.0 HS
Display SPI LCD SPI LCD SPI LCD SPI LCD
Package QFN44 (4X5mm) QFN40 (5X5mm) QFN32 (4X4mm) QFN40 (5X5mm)

Applications

  • Bluetooth Transmitter
  • Bluetooth transceiver integrated device

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