Our ICs
Wireless Transmitter
Bluetooth Audio SoC
General Info
Actions wireless transmission and transceiver series products provide high integration and high performance Bluetooth audio single chip solutions, integrated Bluetooth radio frequency (RF) and baseband, power management unit (PMU), audio codec and MCU. Can be widely used in all kinds of Bluetooth transceiver integrated products, such as gaming earphones and dongle, wireless microphones, conference speakers dongle, communications headset dongle, TV dongle, game-box dongle, intercom adapters, Bluetooth emission slave module, transceiver integrated module, projector/CD/DVD and various devices that require Bluetooth emission (connect Bluetooth headset or Bluetooth speakers) and other low-latency wireless audio transmission and reception products.
Actions Bluetooth transmission and transceiver integrated series products support Bluetooth 5.3 dual mode , support LE Audio mode, transmitting power up to 13dBm, receiving sensitivity -96dbm, complete specifications, leading performance. Support multi-device connection, support line-in, USB, SPDIF, I2S, MIC, SD/MMC, SPI, and other audio input source, support all formats of audio decoding, support screen, Bluetooth speakers and Bluetooth headset is compatible with the mainstream market, support AG 16k hd calls, 10 / MAC compatible with Windows 7 / software and other mainstream operating system and the mainstream mobile phone, The latency of HFP calls the end-to-end (dongle to the speaker the whole link) as low as 60 ms, The A2DP supports the LE Audio mode, which allows end-to-end links latency to be as low as 20ms or less, making it an industry leader. Support two-way HD voice transmission at the same time.
The wireless transmission and transceiver chips are mainly ATS3031,ATS2831P(L) and ATS2851.
Technical Spec PDF Download
BT Version |
CPU |
DSP |
RAM |
SPI norflash |
Max TX Power (BR) |
A2DP |
AVRCP |
HFP |
LE audio |
Dual headset connections |
ACT-LL(Low latency) |
Transmit audio input source |
External RF PA |
USB |
Display |
Package |
ATS3031 | ATS2831P(L) | ATS2851 | ATS2831 | |
BT Version | V5.3 | V5.3 | V5.3 | V5.0 |
CPU | 32bits M4F@96MHz | 32bits RISC@264MHz | 32bits RISC@234MHz | 32bits RISC@240MHz |
DSP | 32bits DSP@170MHz | 32bits DSP@342MHz | 32bits DSP@400MHz | |
RAM | Build-in 632KB | Build-in 498KB | Build-in 203KB | Build-in 336KB |
SPI norflash | Build in 16Mbits Flash | Build in 32Mbits Flash | Build in 16Mbits Flash | Build in 32Mbits Flash |
Max TX Power (BR) | 13dBm | 10dBm | 10dBm | 6dBm |
A2DP | V1.3.2 SRC/SNK | V1.3.2 SRC/SNK | V1.3.2 SRC/SNK | V1.3 SRC/SNK |
AVRCP | V1.6.2 TG/CT | V1.6.2 TG/CT | V1.6.2 TG/CT | V1.6.2 TG/CT |
HFP | V1.8 AG/HF | V1.8 AG/HF | V1.8 HF | V1.7 AG/HF |
LE audio | ||||
Dual headset connections | ||||
ACT-LL(Low latency) | √/24ms(LC3) | 23ms(2831P LC3) / 10ms(2831PL LC3+) | √/30ms | |
Transmit audio input source | LINEIN/USB/I2S/ MICIN | LINEIN/USB/SPDIF/SD/EMMC/I2S/ MICIN | LINEIN/USB/SD/EMMC | LINEIN/USB/SPDIF/SD/EMMC/I2S/MICIN |
External RF PA | ||||
USB | USB2.0 FS | USB2.0 HS | USB2.0 FS | USB2.0 HS |
Display | SPI LCD | SPI LCD | SPI LCD | SPI LCD |
Package | QFN44 (4X5mm) | QFN40 (5X5mm) | QFN32 (4X4mm) | QFN40 (5X5mm) |
Applications
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Bluetooth Transmitter
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Bluetooth transceiver integrated device